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INTEGRATED CIRCUITS
DATA SHEET
TDA9810 Multistandard VIF-PLL with QSS-IF and AM demodulator
Product specification Supersedes data of 1997 Jun 19 File under Integrated Circuits, IC02 1999 May 07
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
FEATURES * 5 V supply voltage * Gain controlled wide band Video Intermediate Frequency (VIF)-amplifier (AC-coupled) * True synchronous demodulation with active carrier regeneration (very linear demodulation, good intermodulation figures, reduced harmonics, excellent pulse response) * Gated phase detector for L/L accent standard; robustness for over-modulation until 105% * Voltage Controlled Oscillator (VCO) frequency switchable between L and L accent (alignment external) picture carrier frequency * Separate video amplifier for sound trap buffering with high video bandwidth * VIF Automatic Gain Control (AGC) detector for gain control, operating as peak sync detector for B/G (optional external AGC) and peak white detector for L; signal controlled reaction time for L ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA9810 TDA9810T SDIP24 SO24 DESCRIPTION plastic shrink dual in-line package; 24 leads (400 mil) plastic small outline package; 24 leads; body width 7.5 mm
TDA9810
* Tuner AGC with adjustable TakeOver Point (TOP) * AFC detector without extra reference circuit * SIF-input for single reference Quasi Split Sound (QSS) mode (Phase Locked Loop (PLL) controlled); Sound Intermediate Frequency (SIF) AGC detector for gain controlled SIF amplifier; single reference QSS mixer able to operate in high performance single reference QSS mode * AM demodulator without extra reference circuit * AM mute (especially for NICAM) * Stabilizer circuit for ripple rejection and to achieve constant output signals. GENERAL DESCRIPTION The TDA9810 is an integrated circuit for multistandard vision IF signal processing and sound AM demodulation, with single reference QSS-IF in TV and VCR sets.
VERSION SOT234-1 SOT137-1
1999 May 07
2
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
QUICK REFERENCE DATA SYMBOL VP IP Vi(VIF)(rms) Vo(CVBS)(p-p) B-3 PARAMETER supply voltage supply current vision IF input signal voltage sensitivity (RMS value) CVBS output signal voltage (peak-to-peak value) -3 dB video bandwidth on pin CVBS B/G and L standard; CL < 20 pF; RL > 1 k; AC load f = 1.1 MHz f = 3.3 MHz -1 dB video at output CONDITIONS MIN. 4.5 77 - 1.7 7
TDA9810
TYP. MAX. UNIT 5 90 60 2.0 8 5.5 103 100 2.3 - V mA V V MHz
S/NW(video) IM(1.1) IM(3.3) H(sup) Vi(SIF)(rms) Vo(intercarrier)(rms)
weighted signal-to-noise ratio for video intermodulation attenuation at `blue' intermodulation attenuation at `blue' suppression of video signal harmonics sound IF input signal voltage sensitivity (RMS value) IF intercarrier level (RMS value)
56 58 58 35 -3 dB at intercarrier output - SC1 output signal SCAM output signal SCNICAM output signal 100 100 14 - - 47
60 64 64 40 30 140 140 20 500 0.5 53
- - - - 70 180 180 26 - 1.0 -
dB dB dB dB V mV mV mV mV % dB
Vo(AF)(rms) THD S/NW
AF output signal voltage (RMS value) total harmonic distortion weighted signal-to-noise ratio
L standard; 54% modulation 54% modulation 54% modulation
1999 May 07
3
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TOP L/L accent gating switch CVAGC CBL tuner AGC RTOP loop filter 14 21 15 3 16 TUNER AND VIF-AGC 2 VIF SAW 1 VIF AMPLIFIER FPLL VIDEO DEMODULATOR AND AMPLIFIER VIDEO BUFFER 23 SIF SAW 24 SIF AMPLIFIER SINGLE REFERENCE MIXER AND AM DEMODULATOR 12 13 CVBS 2 V (p-p) Vi(vid)
BLOCK DIAGRAM
Philips Semiconductors
handbook, full pagewidth
Multistandard VIF-PLL with QSS-IF and AM demodulator
2 x fpc
AFC
4
18
19
17 AFC DETECTOR 9 video 1 V (p-p)
VCO TWD
4
TDA9810
INTERNAL VOLTAGE STABILIZER 22 20 8 SIF-AGC 5 10 7 CSAGC VP = +5 V GND standards selection switch L/L accent switch QSS intercarrier output
AF AMPLIFIER AMPLIFIER SWITCH
6
AF/AM
11
MHA713
AM mute switch
Product specification
TDA9810
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
PINNING SYMBOL Vi VIF1 Vi VIF2 TADJ TPLL CSAGC Vo AF LSWI STD Vo(vid) Vo QSS MUTE Vo CVBS PIN 1 2 3 4 5 6 7 8 9 10 11 12 DESCRIPTION VIF differential input signal voltage 1 VIF differential input signal voltage 2 tuner AGC takeover point adjust PLL loop filter SIF AGC capacitor AM audio frequency output voltage L/L accent switch standard switch composite video output voltage single reference QSS output voltage AM mute switch CVBS output signal voltage SYMBOL Vi(vid) LGATSWI CBL TAGC AFC VCO1 VCO2 GND CVAGC VP Vi SIF1 Vi SIF2 PIN 13 14 15 16 17 18 19 20 21 22 23 24
TDA9810
DESCRIPTION video buffer input voltage L/L accent gating switch black level detector tuner AGC output AFC output VCO1 reference circuit for 2fpc VCO2 reference circuit for 2fpc ground VIF AGC capacitor supply voltage SIF differential input signal voltage 1 SIF differential input signal voltage 2
handbook, halfpage
handbook, halfpage
Vi VIF1 1 Vi VIF2 2 TADJ 3 TPLL 4
24 Vi SIF2 23 Vi SIF1 22 VP 21 CVAGC 20 GND 19 VCO2
Vi VIF1 1 Vi VIF2 2 TADJ 3 TPLL 4 CSAGC 5 Vo AF 6 LSWI 7 STD 8 Vo(vid) 9 Vo QSS 10 MUTE 11 Vo CVBS 12
MHA722
24 Vi SIF2 23 Vi SIF1 22 VP 21 CVAGC 20 GND 19 VCO2
CSAGC 5 Vo AF 6 LSWI 7 STD 8 Vo(vid) 9 Vo QSS 10 MUTE 11 Vo CVBS 12
MHA712
TDA9810
18 VCO1 17 AFC 16 TAGC 15 CBL 14 LGATSWI 13 Vi(vid)
TDA9810T
18 VCO1 17 AFC 16 TAGC 15 CBL 14 LGATSWI 13 Vi(vid)
Fig.2 Pin configuration SDIP24 package. 1999 May 07 5
Fig.3 Pin configuration SO24 package.
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
FUNCTIONAL DESCRIPTION Vision IF amplifier The vision IF amplifier consists of three AC-coupled differential amplifier stages. Each differential stage comprises a feedback network controlled by emitter degeneration. Tuner and VIF AGC The AGC capacitor voltage is transferred to an internal IF control signal, and is fed to the tuner AGC to generate the tuner AGC output current (pin TAGC, open-collector output). The tuner AGC takeover point can be adjusted. This allows the tuner and the SWIF filter to be matched to achieve the optimum IF input level. The AGC detector charges/discharges the AGC capacitor to the required voltage for setting of VIF and tuner gain in order to keep the video signal at a constant level. Therefore for negative video modulation the sync level and for positive video modulation the peak white level of the video signal is detected. In order to reduce the reaction time for positive modulation, where a very large time constant is needed, an additional level detector increases the discharging current of the AGC capacitor (fast mode) in the event of a decreasing VIF amplitude step. The additional level information is given by the black-level detector voltage. Frequency Phase Locked Loop detector (FPLL) The VIF-amplifier output signal is fed into a frequency detector and into a phase detector via a limiting amplifier. During acquisition the frequency detector produces a DC current proportional to the frequency difference between the input and the VCO signal. After frequency lock-in the phase detector produces a DC current proportional to the phase difference between the VCO and the input signal. The DC current of either frequency detector or phase detector is converted into a DC voltage via the loop filter, which controls the VCO frequency. In the event of positive modulated signals the phase detector is gated by composite sync in order to avoid signal distortion for overmodulated VIF signals. This mode can be switched off by the L/L accent gating switch. VCO, Travelling Wave Divider (TWD) and AFC The VCO operates with a resonance circuit (with L and C in parallel) at double the Picture Carrier (PC) frequency.
TDA9810
The VCO is controlled by two integrated variable capacitors. The control voltage required to tune the VCO from its free-running frequency to actually double the PC frequency is generated by the Frequency-Phase detector and fed via the loop filter to the first variable capacitor (FPLL). This control voltage is amplified and additionally converted into a current which represents the AFC output signal. The VCO centre frequency can be decreased (required for L accent standard) by activating an additional internal capacitor. This is achieved by using the L/L accent gating switch. In this event the second variable capacitor can be controlled by a variable resistor at the L/L accent gating switch for setting the VCO centre frequency to the required L accent value. At centre frequency the AFC output current is equal to zero. The oscillator signal is divided-by-two with a TWD which generates two differential output signals with a 90 degree phase difference independent of the frequency. Video demodulator and amplifier The video demodulator is realized by a multiplier which is designed for low distortion and large bandwidth. The vision IF input signal is multiplied with the `in phase' signal of the travelling wave divider output. In the demodulator stage the video signal polarity can be switched in accordance with the TV standard. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the video amplifier. The video amplifier is realized by an operational amplifier with internal feedback and high bandwidth. A low-pass filter is integrated to achieve an attenuation of the carrier harmonics for B/G and L standard. The standard dependent level shift in this stage delivers the same sync level for positive and negative modulation. The video output signal is 1 V (p-p) for nominal vision IF modulation. Video buffer For an easy adaption of the sound traps an operational amplifier with internal feedback is used in the event of B/G and L standard. This amplifier is featured with a high bandwidth and 7 dB gain. The input impedance is adapted for operating in combination with ceramic sound traps. The output stage delivers a nominal 2 V (p-p) positive video signal. Noise clipping is provided.
1999 May 07
6
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SIF amplifier and AGC The sound IF amplifier consists of two AC-coupled differential amplifier stages. Each differential stage comprises a controlled feedback network provided by emitter degeneration. The SIF AGC detector is related to the SIF input signals (average level of AM or FM carriers) and controls the SIF amplifier to provide a constant SIF signal to the AM demodulator and single reference QSS mixer. The SIF AGC reaction time is set to `slow' for nominal video conditions. But with a decreasing VIF amplitude step the SIF AGC is set to `fast' mode controlled by the VIF AGC detector. In FM mode this reaction time is also set to `fast' controlled by the standard switch. Single reference QSS mixer The single reference QSS mixer is realized by a multiplier. The SIF amplifier output signal is fed to the single reference QSS mixer and converted to intercarrier frequency by the regenerated picture carrier (VCO). The mixer output signal is fed via a high-pass for attenuation of the video signal components to the output pin 10. With this system a high performance hi-fi stereo sound processing can be achieved. AM demodulator
TDA9810
The AM demodulator is realized by a multiplier. The modulated SIF amplifier output signal is multiplied in phase with the limited (AM is removed) SIF amplifier output signal. The demodulator output signal is fed via an integrated low-pass filter for attenuation of the carrier harmonics to the AF amplifier. This AM output signal can be muted by using the AM mute switch. Internal voltage stabilizer and 12VP-reference The bandgap circuit internally generates a voltage of approximately 1.25 V, independent of supply voltage and temperature. A voltage regulator circuit, connected to this voltage, produces a constant voltage of 3.6 V which is used as an internal reference voltage. For all audio output signals the constant reference voltage cannot be used because large output signals are required. Therefore these signals refer to half the supply voltage to achieve a symmetrical headroom, especially for the rail-to-rail output stage. For ripple and noise attenuation the 12VP voltage has to be filtered via a low-pass filter by using an external capacitor together with an integrated resistor (f-3dB = 5 Hz). For a fast setting to 12VP an internal start-up circuit is available.
1999 May 07
7
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP VI tsc(max) VTAGC Tstg Tamb Ves Notes 1. IP = 103 mA; Tamb = 70 C; Rth j-a = 69 K/W for SDIP24 and Rth j-a = 90 K/W for SO24. 2. Machine Model class B: L = 2.5 H. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT234-1 SOT137-1 PARAMETER thermal resistance from junction to ambient CONDITIONS in free air PARAMETER supply voltage (pin 22) input voltage at pins 1 to 8, 11, 13 to 17 and 20 to 24 maximum short-circuit time tuner AGC output voltage storage temperature operating ambient temperature electrostatic handling voltage note 2 CONDITIONS maximum chip temperature of 125 C; note 1 0 0 - 0 -25 -20 -300 MIN.
TDA9810
MAX. 5.5 VP 10 13.2 +150 +70 +300 V V s V C C V
UNIT
VALUE 69 90
UNIT K/W K/W
1999 May 07
8
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
CHARACTERISTICS VP = 5 V; Tamb = 25 C; see Table 1 for input frequencies and level; input level Vi(IF)(rms) = 10 mV (sync-level for B/G, peak white level for L); IF input from 50 via broadband transformer 1 : 1; video modulation DSB; residual carrier B/G: 10%; L = 3%; video signal in accordance with "CCIR, line 17"; measurements taken in Fig.14; unless otherwise specified. SYMBOL Supply (pin 22) VP IP Vi(VIF)(rms) Vi(max)(rms) Vo(int) supply voltage supply current B/G standard; -1 dB video at output B/G standard; +1 dB video at output within AGC range; B/G standard; f = 5.5 MHz see Fig.4 note 2 note 2 note 1 4.5 77 - 120 - 5 90 5.5 103 V mA V mV dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Vision IF amplifier (pins 1 and 2) input signal voltage sensitivity (RMS value) maximum input signal voltage (RMS value) internal IF amplitude difference between picture and sound carrier IF gain control range differential input resistance DC input voltage 60 200 0.7 100 - 1
GIFcr Ri(diff) Ci(diff) VI(1,2) fVCO(max)
65 1.7 1.2 -
70 2.2 1.7 3.4
- 2.7 2.5 - -
dB k pF V
differential input capacitance note 2
True synchronous video demodulator; note 3 maximum oscillator frequency for carrier regeneration oscillator drift as a function of temperature oscillator voltage swing at pins 18 and 19 (RMS value) picture carrier capture frequency range B/G and L standard L accent standard; fpc = 33.9 MHz; R7 = 5.6 k L accent standard; fpc = 33.9 MHz; R7 = 5.6 k IAFC = 0 BL = 70 kHz; note 5 maximum IF gain; note 6 f = 2fpc 125 130 MHz
fosc/T VVCO(rms) fcr(pc)
oscillator is free-running; IAFC = 0; note 4
- 70 1.5 1.0
- 100 2.0 1.3
20 x 10-6 K-1 130 - - mV MHz MHz
fpc(fr)
picture carrier frequency (free-running) accuracy L accent alignment frequency range acquisition time VIF input signal voltage sensitivity for PLL to be locked (RMS value; pins 1 and 2) FPLL offset current at pin 4
-
200
400
kHz
falg(L accent) tacq Vi(VIF)(rms)
400 - -
600 - 30
- 30 70
kHz ms V
Ioffset(FPLL)
note 7
-
-
4.5
A
1999 May 07
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Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9810
MAX.
UNIT
Composite video amplifier (pin 9; sound carrier off) Vo(video)(p-p) V/S output signal voltage (peak-to-peak value) ratio between video (black-to-white) and sync level sync voltage level upper video clipping voltage level lower video clipping voltage level output resistance internal DC bias current for emitter-follower maximum AC and DC output sink current maximum AC and DC output source current -1 dB video bandwidth B/G and L standard; CL < 50 pF; RL > 1 k; AC load B/G and L standard; CL < 50 pF; RL > 1 k; AC load CL < 50 pF; RL > 1 k; AC load; note 8a note 2 B/G and L standard see Fig.9 0.88 1.9 1.0 2.33 1.12 3.0 V -
Vsync(9) Vclu(9) Vcll(9) Ro(9) Ibias(9)(int) Isink(9)(max) Isource(9)(max) B-1
-
1.5
- - 0.4 10 - - - -
V V V mA mA mA MHz
VP - 1.1 VP - 1 - - 2.2 1.6 2.9 5 0.3 - 3.0 - - 6
B-3
-3 dB video bandwidth
7
8
-
MHz
H(sup) PSRR
suppression of video signal harmonics
35
40
-
dB
power supply ripple rejection video signal; grey level; at pin 9 see Fig.12 B/G standard L standard 32 26 35 30 - - dB dB
CVBS buffer amplifier (only) and noise clipper (pins 12 and 13) Ri(13) Ci(13) VI(13) Gv Vclu(12) Vcll(12) Ro(12) Ibias(12)(int) Isink(12)(max) input resistance input capacitance DC input voltage voltage gain upper video clipping voltage level lower video clipping voltage level output resistance DC internal bias current for emitter-follower maximum AC and DC output sink current 10 note 2 note 2 note 2 2.6 1.4 1.4 B/G and L standard; note 9 6.5 3.9 - - 2.0 1.4 3.3 2 1.7 7 4.0 1.0 - 2.5 - 4.0 3.0 2.0 7.5 - 1.1 10 - - k pF V dB V V mA mA
1999 May 07
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL Isource(12)(max) B-1 PARAMETER maximum AC and DC output source current -1 dB video bandwidth B/G and L standard; CL < 20 pF; RL > 1 k; AC load B/G and L standard; CL < 20 pF; RL > 1 k; AC load CONDITIONS MIN. 2.4 8.4 - 11 TYP. - -
TDA9810
MAX.
UNIT mA MHz
B-3
-3 dB video bandwidth
11
14
-
MHz
Measurements from IF input to CVBS output (pin 12; 330 between pins 9 and 13, sound carrier off) Vo(CVBS)(p-p) CVBS output signal voltage on pin 12 (peak-to-peak value) output signal voltage difference sync voltage level deviation of CVBS output signal voltage at B/G black level tilt in B/G standard black level tilt for worst case in L standard differential gain differential phase -1 dB video bandwidth note 9 1.7 2.0 2.3 V
Vo(CVBS) Vo(CVBS)(sync) Vo(CVBS) Vo(bl)(BG) Vo(bl)(L)
difference between B/G and L standard B/G standard L standard 50 dB gain control 30 dB gain control gain variation; note 10 vision carrier modulated by test line (VITS) only; gain variation; note 10
- - - - - - -
- 1.35 1.35 - - - -
10 - - 0.5 0.1 1 1.9
% V V dB dB % %
Gdiff diff B-1
"CCIR, line 330" "CCIR, line 330"
CL < 20 pF; RL > 1 k; AC load; B/G and L standard CL < 20 pF; RL > 1 k; AC load; B/G and L standard see Fig.6 and note 11 see Fig.6 and note 11 f = 1.1 MHz; see Fig.7 and note 12 f = 1.1 MHz; see Fig.7 and note 12 f = 3.3 MHz; see Fig.7 and note 12 f = 3.3 MHz; see Fig.7 and note 12
- - 5
2 1 6
5 2 -
% deg MHz
B-3
-3 dB video bandwidth
7
8
-
MHz
S/NW(video) S/N IM(1.1)
weighted signal-to-noise ratio for video unweighted signal-to-noise ratio intermodulation attenuation at `blue' intermodulation attenuation at `yellow'
56 49 58 60 58 59
60 53 64 66 64 65
- - - - - -
dB dB dB dB dB dB
IM(3.3)
intermodulation attenuation at `blue' intermodulation attenuation at `yellow'
1999 May 07
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Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL c(rms) PARAMETER residual vision carrier (RMS value) robustness for unwanted frequency deviation of picture carrier (peak-to-peak value) robustness for modulator imbalance CONDITIONS fundamental wave and harmonics; B/G and L standard L standard; residual carrier: 3%; serration pulses: 50%; note 2 L standard; residual carrier: 0%; serration pulses: 50%; note 2 note 8a note 8b - MIN. 2 TYP. 5
TDA9810
MAX.
UNIT mV
funwanted(p-p)
-
-
12
kHz
-
-
3
%
H(sup) H(spur) PSRR
suppression of video signal harmonics spurious elements
35 40
40 -
- -
dB dB
power supply ripple rejection video signal; grey level; at pin 12 see Fig.12 B/G standard L standard 25 20 28 23 - - dB dB
VIF-AGC detector (pin 21) Ich(21) charging current additional charging current B/G and L standard; note 10 L standard in event of missing VITS pulses and no white video content B/G standard normal mode L standard fast mode L standard tresp(AGC)(r) tresp(AGC)(f) AGC response to a rising VIF step AGC response to a falling VIF step B/G and L standard; note 13 B/G standard fast mode L standard normal mode L standard; note 13 IF Vth(15) VIF amplitude step for activating fast AGC mode threshold voltage level additional charging current L standard see Fig.9 L standard L standard; fast mode L - - 1.95 1.65 - - V V 0.75 1.9 1 2.5 1.25 3.1 mA A
discharging current
15 225 30 - - - - -2
20 300 40 0.05 2.2 1.1 150 -6
25 375 50 0.1 3.5 1.8 240 -10
A nA A ms/dB ms/dB ms/dB ms/dB dB
1999 May 07
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Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL Tuner AGC (pin 16) Vi(rms) IF input signal voltage for minimum starting point of tuner takeover (RMS value) IF input signal voltage for maximum starting point of tuner takeover (RMS value) Vo(16)(max) Vsat(16) VTOP(16)/T Isink(16) maximum output voltage saturation voltage input at pins 1 and 2; - RTOP = 22 k; I16 = 0.4 mA input at pins 1 and 2; RTOP = 0 ; I16 = 0.4 mA from external source; note 2 I16 = 1.5 mA 50 2 5 PARAMETER CONDITIONS MIN. TYP.
TDA9810
MAX.
UNIT
mV
100
-
mV
- - -
- - 0.03
13.2 0.2 0.07
V V dB/K
variation of takeover point by I16 = 0.4 mA temperature sink current see Fig.4 no tuner gain reduction; V16 = 13.2 V maximum tuner gain reduction
- 1.5 -
- 2 6
1 2.6 8
A mA dB
GIF
IF slip by automatic gain control control steepness I17/f frequency variation by temperature output voltage upper limit output voltage lower limit output source current output sink current
tuner gain current from 20 to 80%
AFC circuit (pin 17); see Fig.8 and note 14 S fIF/T Vo(17)(max) Vo(17)(min) Io(source)(17) Io(sink)(17) I17(p-p) note 15 B/G and L standard; IAFC = 0; note 4 0.5 - 0.75 - 1.0 20 x 10-6 A/kHz K-1 V V A A A
VP - 0.6 VP - 0.3 - - 150 150 - 0.3 200 200 20 0.6 250 250 30
residual video modulation B/G and L standard current (peak-to-peak value)
1999 May 07
13
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL PARAMETER CONDITIONS FM mode; -3 dB at intercarrier output pin 10 AM mode; -3 dB at AF output pin 6 Vi(max)(rms) maximum input signal voltage (RMS value) FM mode; +1 dB at intercarrier output pin 10 AM mode; +1 dB at AF output pin 6 Gcr(SIF) Ri(diff) Ci(diff) VI(23,24) SIF,VIF SIF gain control range differential input resistance DC input voltage crosstalk attenuation between SIF and VIF input between pins 1 and 2 and pins 23 and 24; note 16 FM and AM mode; see Fig.5 note 2 - - 50 80 60 1.7 1.2 - 50 MIN. TYP.
TDA9810
MAX.
UNIT V V mV mV dB k pF V dB
Sound IF amplifier (pins 23 and 24) Vi(SIF)(rms) input signal voltage sensitivity (RMS value) 30 70 70 140 67 2.2 1.7 3.4 - 70 100 - - - 2.7 2.5 - -
differential input capacitance note 2
SIF-AGC detector (pin 5) Ich(5) Idch(5) charging current discharging current FM mode AM mode FM mode normal mode AM fast mode AM Single reference QSS intercarrier mixer (pin 10); note 17 Vo(intercarrier)(rms) IF intercarrier level (RMS value) B/G standard; SC1; sound carrier 2 off L standard; without modulation NICAM B-3 c(rms) Ro(10) VO(10) Ibias(int)(10) I(sink)(max)10 I(source)(max)10 -3 dB intercarrier bandwidth upper limit residual sound carrier (RMS value) output resistance DC output voltage DC internal bias current for emitter-follower maximum AC and DC output sink current maximum AC and DC output source current fundamental wave and harmonics note 2 100 100 14 7.5 - - - 1.5 1.1 3.0 140 140 20 9 2 - 2.0 1.9 1.5 3.5 180 180 26 - - 25 - - - - mV mV mV MHz mV V mA mA mA 8 0.8 8 1 60 12 1.2 12 1.4 85 16 1.6 16 1.8 110 A A A A A
1999 May 07
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Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL PARAMETER CONDITIONS MIN. - TYP. -
TDA9810
MAX.
UNIT
Single reference QSS AF performance for FM operation (B/G standard); notes 18 to 21; see Table 1 S/NW(SC1) weighted signal-to-noise ratio for SC1 PC/SC1 ratio at pins 1 and 2; 27 kHz (54% FM deviation); "CCIR 468-4" black picture white picture 40 dB
53 52
58 55 48 45
- - - -
dB dB dB dB
6 kHz sine wave (black to 44 white modulation) 250 kHz square wave (black to white modulation) sound carrier subharmonics; f = 2.75 MHz 3 kHz sound carrier subharmonics; f = 2.87 MHz 3 kHz S/NW(SC2) weighted signal-to-noise ratio for SC2 PC/SC2 ratio at pins 1 and 2; 27 kHz (54% FM deviation); "CCIR 468-4" black picture white picture 40
45
51
-
dB
46
52
-
dB
40
-
-
dB
48 46
55 52 46 34
- - - -
dB dB dB dB
6 kHz sine wave (black to 42 white modulation) 250 kHz square wave (black to white modulation) sound carrier subharmonics; f = 2.75 MHz 3 kHz sound carrier subharmonics; f = 2.87 MHz 3 kHz AM operation (L standard; pin 6); note 22 Vo(AF)(rms) THD B-3 S/NW V6 PSRR AF output signal voltage (RMS value) total harmonic distortion -3 dB AF bandwidth weighted signal-to-noise ratio DC potential voltage 54% modulation 54% modulation; see Fig.11 400 - 100 29
44
50
-
dB
45
51
-
dB
500 0.5 125 53 2.5 25
600 1.0 - - - -
mV % kHz dB V dB
"CCIR 468-4"; see Fig.10
47
tracked with supply voltage - 22
power supply ripple rejection see Fig.12
1999 May 07
15
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA9810
MAX.
UNIT
AM mute switch (pin 11) V11 DC potential input voltage for no mute input voltage for mute IIL V14 LOW level input current V11 = 0 V L/L accent gating switch (pin 14) DC potential voltage for gating on gating off IIL Notes 1. Values of video and sound parameters are decreased at VP = 4.5 V. 2. This parameter is not tested during production and is only given as application information for designing the television receiver. 3. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d 3; calculated for peak level). Resonance circuit of VCO: Q0 > 50; Cext = 8.2 pF 0.25 pF; Cint 8.5 pF (loop voltage 2.7 V). 4. Temperature coefficient of external LC-circuit is equal to zero. 5. Vi(IF)(rms) = 10 mV; f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video modulation. 6. Vi(IF) signal for nominal video signal. 7. Offset current measured between pin 4 and half of supply voltage (VP = 2.5 V) under the following conditions: no input signal at VIF input (pins 1 and 2) and VIF amplifier gain at minimum (V21 = VP). Due to sample-and-hold mode of the FPLL in L standard, the leakage current of the loop filter capacitor (C = 220 nF) should not exceed 500 nA. 8. Measurements taken with SAW filter K6257 (sound carrier suppression: 40 dB); loop bandwidth = 70 kHz. a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz. b) Sound carrier on; SIF SAW filter K9453; fvideo = 10 kHz to 10 MHz. 9. The 7 dB buffer gain accounts for 1 dB loss in the sound trap. Buffer output signal is typically 2 V (p-p), in event of CVBS video amplifier output typical 1 V (p-p). If no sound trap is applied a 330 resistor must be connected from output to input (from pin 9 to pin 13). 10. The leakage current of the AGC capacitor should not exceed 1 A at B/G standard respectively 10 nA current at L standard. Larger currents will increase the tilt. 11. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 12). B = 5 MHz weighted in accordance with "CCIR 567". 12. The intermodulation figures are defined: V 0 at 4.4 MHz IM ( 1.1 ) = 20 log ------------------------------------- + 3.6dB ; IM(1.1) value at 1.1 MHz referenced to black/white signal; V 0 at 1.1 MHz V 0 at 4.4 MHz IM ( 3.3 ) = 20 log ------------------------------------- ; IM(3.3) value at 3.3 MHz referenced to colour carrier. V 0 at 3.3 MHz 13. Response speed valid for a VIF input level range of 200 V up to 70 mV. 14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is given in Fig.8. The AFC-steepness can be changed by the resistors at pin 17. 1999 May 07 16 LOW level input current V14 = 0 V note 23 2.8 0 140 - - 200 VP 2.0 260 V V A note 23 2.8 0 175 - - 250 VP 0.8 325 V V A
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
15. Depending on the ratio C/C0 of the LC resonant circuit of VCO (Q0 > 50; see note 3; C0 = Cint + Cext). 16. Source impedance: 2.3 k in parallel to 12 pF (SAW filter); fIF = 38.9 MHz. 17. For picture to sound carrier ratio see Table 1. The NICAM L subcarrier is 17 dB lower than the AM sound carrier and depends on its AM modulation. 18. The Vo QSS output (pin 10) is analysed by a test demodulator TDA9820. The S/N ratio of this IC is more than 60 dB, related to a deviation of 27 kHz, in accordance with "CCIR 468-4". 19. For all S/N measurements the used vision IF modulator has to meet the following specifications: a) Incidental phase modulation for black-to-white jump less than 0.5 degrees. b) QSS AF performance, measured with the television-demodulator AMF2 (audio output, weighted S/N ratio) better than 60 dB (deviation 27 kHz) for 6 kHz sine wave black-to-white video modulation. c) Picture-to-sound carrier ratio; PC/SC1 = 13 dB; (transmitter). 20. Measurements taken with SAW filter K6257 (Siemens) for vision IF (suppressed sound carrier) and K9453 (Siemens) for sound IF (suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 27 kHz (54% FM deviation). 21. The PC/SC ratio at pins 1 and 2 is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC ratio is necessary to achieve the S/NW values as noted. A different PC/SC ratio will change these values. 22. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier). 23. The input voltage has to be Vi > 2.8 V, or open-circuit. Table 1 Input frequencies and carrier ratios SYMBOL fpc fsc1 fsc2/NICAM Picture to sound carrier ratio Table 2 Switch logic FM-PLL SELECTED STANDARD B/G L VIDEO POLARITY 1 negative positive on on off B/G, with external VIF AGC negative 2 on on off 1 FM FM AM 2 FM FM mute AF-AMPLIFIER PC/SC1 PC/SC2/NICAM B/G STANDARD L STANDARD 38.9 33.4 33.158 13 20 38.9 32.4 - 10 - L ACCENT STANDARD 33.9 40.4 - 10 - NICAM L 38.9 32.4 32.05 10 27 UNIT MHz MHz MHz dB dB
DESCRIPTION Picture carrier Sound carrier
STANDARD SWITCH (PIN 8) 2.8 V to VP 1.3 to 2.3 V 0 to 0.8 V
1999 May 07
17
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
andbook, full pagewidth gain
70
MHA714
0.06
(dB) 60 Ituner (mA) 0
Vi(VIF)(rms) (mV) 0.6
50
40
30
(1) (2) (3) (4)
6
20
1
10
60
0 2 -10 1 1.5 2 2.5 3 3.5 4 V21 (V) 4.5
(1) Ituner; RTOP = 22 k. (2) Gain.
(3) Ituner; RTOP = 11 k. (4) Ituner; RTOP = 0 .
Fig.4 Typical VIF and tuner AGC characteristic.
handbook, full pagewidth
110
MHA715
100
(dBV) 100
Vi(SIF)(rms) 90 (mV) 10 80 70 1 60 50 0.1 40 30 0.01 20 1 (1) AM mode. (2) FM mode. 1.5 2 2.5 3 3.5 4 V5 (V) 4.5
(1)
(2)
Fig.5 Typical SIF AGC characteristic.
1999 May 07
18
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
handbook, halfpage
75
MED684
S/N (dB)
handbook, halfpage
3.2 dB 10 dB 13.2 dB 27 dB
50
13.2 dB 27 dB
25
SC CC
PC
SC CC
PC
BLUE
0 -60 0.06 -40 0.6 -20 6 10 0 20
YELLOW
MED685 - 1
Vi (VIF)(rms)(dB) 60 600 Vi (VIF)(rms)(mV)
SC = sound carrier, with respect to sync level. CC = chrominance carrier, with respect to sync level. PC = picture carrier, with respect to sync level. The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter G1962).
Fig.6
Typical signal-to-noise ratio as a function of IF input voltage.
Fig.7 Input signal conditions.
handbook, full pagewidth
VP
VP = 5 V
VAFC I17 (V) (A) 200 100 2.5 0 100 200
MHA716
22 k
(source current)
TDA9810 17
I17 VAFC 22 k
(sink current)
38.5
38.9
39.3 f (MHz)
Fig.8 Measurement conditions and typical AFC characteristic.
1999 May 07
19
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
handbook, halfpage 2.5 V
white level
1.8 V 1.5 V
black level sync level
B/G standard
2.5 V white level
1.95 V 1.8 V 1.65 V 1.5 V
threshold level black level threshold level sync level
L standard
MED864
Fig.9 Typical video signal levels on output pin 9 (sound carrier off).
handbook, full pagewidth
10 CCIR-468 (dB) 0
MED688
(1)
10
20
30
40
50 (2) 60
70 30
40
50
60
70
80
90 input voltage (dBV)
100
(1) Signal. (2) Noise.
Fig.10 Typical audio signal-to-noise ratio as a function of input signal at AM standard (m = 54%).
1999 May 07
20
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
MED689
handbook, full pagewidth
1.25
THD (%) 1.0
0.75
0.5
0.25
0 10 2
10 1
1
10
f (kHz)
10 2
CAGC = 2.2 F.
Fig.11 Typical total harmonic distortion as a function of audio frequency at AM standard (m = 54%).
handbook, full pagewidth
VP = 5 V VP = 5 V 100 mV (fripple = 70 Hz)
TDA9810
MHA717
t
Fig.12 Ripple rejection condition.
1999 May 07
21
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VP 22 GND 20 21 + + 23 1.1 k + 1.1 k 24 1 mA 10 k 10 k 16 + 1 1.1 k 3.6 V + 1.1 k 2 24 k 0.6 A + + 3.6 V VCO 24 k + 67 A + 1 mA 25 A 120 23 A + + 2.5 mA + + + 25 pF + + 13 k 3.6 V 16 k + 3.6 V 17 k + + 2.3 mA 9 k 24 k 13 k 3.6 V 16 k 3.6 V 13 k + 14 2.5 mA 1 k 1 k 3.0 mA + 3.6 V ++ + 420 420 200 A + 3.3 k 2.2 k + 19 + + + + 9 k 1.7 pF 2.8 V 2 k 1.7 pF 1.9 mA + 18 17 13 9 10 0.5 pF 10 k 1.6 k
INTERNAL PIN CONFIGURATION
Philips Semiconductors
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
16 k
handbook, full pagewidth
22
2.5 A
20 k
+
9 k
+
14.7 k +
Product specification
15
3
4
5
8
12
7
6
11
MHA720
TDA9810
Fig.13 Internal pin configuration.
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VP 22 k 100 nF 10 nF 1:1 SIF input 50 1 2 3 5 4 VIF AGC 24 23 22 21 2.2 F GND 8.2 pF CBL 20 19 18 17 16 15 100 nF 330 14 13 Q0 50 tuner AGC L/L accent gating switch 22 k AFC
handbook, full pagewidth
TEST AND APPLICATION INFORMATION
Philips Semiconductors
Multistandard VIF-PLL with QSS-IF and AM demodulator
23
1 2 3 4 5 1:1 VIF input 50 1 2 3 5 4 TOP 22 k 330 SIF AGC 220 nF 2.2 F loop filter
TDA9810
6 7 8 9 10 11 12
22 k AFAM L/L accent switch standards selection switch +5 V
22 k AM mute switch CVBS
video output
QSS intercarrier output
MHA718
Product specification
TDA9810
Fig.14 Test circuit.
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VP 22 k 100 nF 10 nF 22 k AFC L/L accent gating switch 330 IF input 50 SAW FILTER K9453
(1)
Philips Semiconductors
Multistandard VIF-PLL with QSS-IF and AM demodulator
Q0
50
tuner AGC 100 nF
VIF AGC 24 23 22 21
2.2 F
GND
8.2 pF CBL
15 H
20
19
18
17
16
15
14
13
handbook, full pagewidth
24
1 2 3 4 5 SAW FILTER K6257
(1)
TDA9810
6 7 8 9 10 11 12
TOP 22 k
330
SIF AGC 220 nF
2.2 F
(2)
22 k
22 k AM mute switch CVBS
de-emphasis depending on TV standard/stereo decoder L/L accent switch +5 V
video output
loop filter
QSS intercarrier output standards selection switch
MHA719
Product specification
TDA9810
(1) Depends on standard. (2) Only required for external AGC mode.
Fig.15 Application circuit.
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
PACKAGE OUTLINES SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
TDA9810
SOT234-1
D seating plane
ME
A2
A
L
A1 c Z e b 24 13 b1 wM (e 1) MH
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.7 A1 min. 0.51 A2 max. 3.8 b 1.3 0.8 b1 0.53 0.40 c 0.32 0.23 D (1) 22.3 21.4 E (1) 9.1 8.7 e 1.778 e1 10.16 L 3.2 2.8 ME 10.7 10.2 MH 12.2 10.5 w 0.18 Z (1) max. 1.6
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT234-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1999 May 07
25
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
TDA9810
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 95-01-24 97-05-22
1999 May 07
26
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. 1999 May 07 27 MANUAL SOLDERING
TDA9810
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA9810
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. suitable(2) not suitable not not not suitable(3) recommended(4)(5) recommended(6) suitable REFLOW(1) - suitable suitable suitable suitable suitable - - - - - DIPPING suitable
1999 May 07
28
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
NOTES
TDA9810
1999 May 07
29
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
NOTES
TDA9810
1999 May 07
30
Philips Semiconductors
Product specification
Multistandard VIF-PLL with QSS-IF and AM demodulator
NOTES
TDA9810
1999 May 07
31
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 64
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/750/02/pp32
Date of release: 1999 May 07
Document order number:
9397 750 05317

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